In the highly precise industrial field of semiconductor manufacturing, even a deviation of one nanometer can affect chip yield and performance.

The layout of the wafer mounting plate needs to be coordinated with the overall system, taking into account interface layout, connector matching and EMC compatibility.

In heavy machinery, energy equipment, rail transportation, and even precision industrial equipment, many critical components often possess irregular curved surfaces, internal cavities, multi-directional branches, or alternating thicknesses.

In the precision world of semiconductor manufacturing, the wafer mounting plate (Wafer Chuck), while not directly involved in circuit pattern formation, is an indispensable "silent foundation" throughout the entire process.

In the field of sheet metal customization, material selection is the primary factor determining product performance, process feasibility, and economics.

Simultaneously, to avoid mechanical stress or even cracking between the wafer and substrate caused by temperature changes, the wafer mounting plate must also possess extremely low thermal deformation characteristics.