In the precision world of semiconductor manufacturing, the wafer mounting plate (Wafer Chuck), while not directly involved in circuit pattern formation, is an indispensable "silent foundation" throughout the entire process.

In the field of sheet metal customization, material selection is the primary factor determining product performance, process feasibility, and economics.

Simultaneously, to avoid mechanical stress or even cracking between the wafer and substrate caused by temperature changes, the wafer mounting plate must also possess extremely low thermal deformation characteristics.

In the precision world of semiconductor manufacturing, even a nanometer-level deviation can determine the success or failure of chip yield.

In sheet metal customization, the sealing of the metal sheet splicing process directly affects the waterproofness, dustproofness and structural stability of the product.

Sheet metal customization is more than just processing; it's a form of creation. Through intelligent and sophisticated process chains, it transforms cold sheet metal into the "skeletal" and "exterior" that underpin modern industry.